Ensuring signal and power integrity in electronic board designs
Everything you need to know to accelerate innovation by exploring simulation in electronic component R&D
The ever-evolving hardware to support high-speed signal technologies, such as Big Data and the Internet of Things, requires rapid and reliable development of PCBs.
In the ESSS SI/PI Marathon, you will practically understand how computational simulation provides benefits to meet these demands through signal and power integrity analyses.
We will guide you step by step through the Ansys HFSS and SIwave tools, using real cases, from importing the analyzed structure to the final results.
In this marathon, you will see:
- Signal integrity simulation
- Difference and creation of different types of power ports
- Crosstalk analysis
- Analysis including the physical model of connectors
- Eye diagram results
- Jitter visualization
- Power integrity simulation
- DC Drop simulations
- Analysis of current and voltage distributions
- Relevant topics for SI/PI
Presenter:
Carlos Eduardo Ehmke Agra
CAE Applications Specialist – ESSS
Carlos Ehmke holds a Bachelor's Degree in Electrical Engineering from the Federal University of Santa Catarina and boasts four years of expertise in low and high-frequency electromagnetic device projects. His diverse knowledge covers the design and development of PCBs, antennas, transmission lines, motors, and transformers. Specializing in Ansys Electronics Desktop applications, he excels in using tools like Maxwell, HFSS, HFSS 3D layout, and Circuit to tackle complex engineering challenges.
SHARE THIS EVENT
